Sample

Studied diffusion area

Junction depth (µm)

Chemical etching method

Electrochemical plating method

SEI

SEPC

EBIC

Spreading resistance for reference

n-p

n

9.1 (1.1)

9.2 (1.0)

8.3 (2.1)

8.0 (0.1)

8.4 (1.3)

8.0

n-p-n-p

n+

10.4 (1.0)

10.9 (1.4)

9.2 (2.3)

9.8 (0.2)

10.3 (1.5)

10.0

p+ (front side)

23.3 (1.5)

(*)

(*)

(*)

(*)

25.0

p

72.6 (2.1)

74.1 (1.6)

74.7 (4.3)

72.5 (0.2)

74.8 (2.6)

72.0

p+ (back side)

22.9 (1.4)

23.2 (1.3)

24.7 (3.0)

22.4 (0.2)

23.1 (1.7)

22.0