S. No

Process

Measurements

Remarks

1

Texture and Clean + PECVD Si₃N₄ (double side) + Co-fire

QSSPC

Textured wafers + Si₃N₄ passivation

2

Texture and Clean + Diffusion + Edge isolation + PECVD Si₃N₄ (double side) + Co-fire

QSSPC

Baseline wafers + Si₃N₄ passivation

3

Texture and Clean + Diffusion + Edge isolation + Anneal + PECVD Si₃N₄ (double side) + Co-fire

QSSPC

Trial wafers + Si₃N₄ passivation