Region

Parameters

Material

Thickness (nm)

Doping (cm−3)

Ge component

Strain silicon in Emitter

Si

12

1 × 1018

0

Polysilicon in Emitter

Poly Si

88

1 × 1020

0

Base

Si1xGex

20

1 × 1019

15 - 30

Collector

Si

60

5 × 1017

0

Collector stress region

Si1yGey

60

0

15

N+ silicon

Si

20

1 × 1020

0

Buried oxide

Oxide

100

0

0

Silicon substrate

Si

200

1 × 1015

0