Eff.

Area

(cm²)

V_oc

(V)

J_sc

(mA/cm²)

FF

(%)

Inter-connect

Note

25.5

0.25

2.847

10.94

81.83

Wafer bonding

OCU 2015

28.2

25.6

/2.6

0.95

2.33

0.52

13.7

7.6

80.1

65.2

4-terminal

TTI 2016

33.0

3.604

2.446

0.694

13.9

8.3

84.7

76.6

4-terminal

Sharp 2017

30.8

0.09538

3.03

12.72

80.0

PdNP array

AIST 2019