| Plating bath composition | Pd plating bath | Pd/Ag Plating bath |
| Pd precursor | PdCl2 2.2 g | PdCl2 2.1 g |
| Ag precursor |
| AgNO3 0.7 g |
| Complexing agents | Na2EDTA 25.0 g | Na2EDTA 31 g |
|
| NH4OH 220 mL | NH4OH 200 mL |
| Reducing agent | 1M N2H4 10 mL | 1M N2H4 10 mL |
| Plating temperature | 333 K | 333 K |