Parameters

Relative variation of temperature

Horizontal Orientation

vertical Orientation

Die junction center

Lid top center

PCB bottom center

PCB bottom corner

Die junction center

Lid top center

PCB bottom

center

PCB bottom corner down

PCB bottom corner up

Radiation

42.1%

42.3%

49.4%

80.6%

42.7%

43%

49.8%

65.7%

97.6%

CFD

8.6%

8.7%

8.5%

12.6%

9.4%

9.5%

10.2%

5.8%

25.7%

Substrate dielectric vias

5.4%

5.4%

1.4%

0.4%

5.6%

5.6%

1.3%

0.3%

0.3%

Substrate core PTH

2.4%

2.4%

0.7%

0.07%

2.5%

2.5%

0.7%

0.1%

0.2%

PCB thermal resistance

2%

2%

2.2%

1.8%

1%

1%

1%

5.2%

1.8%

PCB Emissivity

1.9%

1.9%

2.3%

2.9%

1.5%

1.5%

1.8%

2.2%

3.4%

Substrate thermal resistance

1.5%

1.5%

0.8%

0.3%

1.5%

1.5%

0.8%

0.2%

0.04%

PCB FR4 vertical conductivity

0.7%

0.7%

0.3%

0.03%

0.7%

0.7%

0.3%

0.02%

0.1%

Still air chamber inclination

0.7%

0.7%

0.3%

3.6%

0.04%

0.04%

0.05%

0.06%

0.2%

Laminated substrate copper distribution

0.4%

0.4%

0.4%

0.05%

0.4%

0.4%

0.5%

0.1%

0,01%

Substrate dielectric conductivity

0.4%

0.4%

0.03%

0.01%

0.4%

0.4%

0.1%

0.1%

0.02%

Lid conductivity

0.3%

0.3%

0.01%

0.05%

0.26%

0.29%

0.13%

0.03%

0.02%

Substrate core conductivity

0.2%

0.2%

0.01%

0.04%

0.2%

0.2%

0.01%

0.01%

0.03%

Box emissivity

0.2%

0.2%

0.2%

0.4%

0.3%

0.3%

0.3%

0.6%

0.6%

PCB FR4 in-plane conductivity

0.1%

0.1%

0.12%

0.07%

0.10%

0.10%

0.12%

0.07%

0.01%

TIM thickness

0.1%

0%

0.03%

0.01%

0.07%

0.02%

0.03%

0.01%

0%

BGA conductivity

0.1%

0.1%

0.03%

0.04%

0.03%

0.03%

0.01%

0.01%

0.01%

PCB thermal vias

0.1%

0.1%

0.2%

0.01%

0.01%

0.01%

0.16%

0.04%

0.2%

TIM conductivity

0.01%

0.01%

0.01%

0%

0.04%

0.01%

0.03%

0.03%

0.05%

Underfill conductivity

0.01%

0.01%

0.05%

0.02%

0.01%

0%

0.04%

0.05%

0.05%

Underfill flux tube

0.01%

0.01%

0.05%

0.02%

0.01%

0%

0.04%

0.05%

0.05%