| Parameters | Nominal | Variation |
| Lid conductivity | 385 W/mK | +10% |
| TIM thickness | 30 µm | +10% |
| TIM conductivity | 2.6 W/mK | +10% |
| Underfill conductivity | 0.65 W/mK | +10% |
| Underfill flux tube | On | On - off |
| Substrate thermal resistance | 0.022 K/W | +10% |
| Laminated substrate copper distribution | On | On - off |
| Substrate core conductivity | 0.8 W/mK | +10% |
| Substrate core PTH | On | On - off |
| Substrate dielectric conductivity | 0.49 W/mK | +10% |
| Substratte dielectric vias | On | On - off |
| BGA conductivity | 57 W/mK | +10% |
| PCB thermal resistance | 0.047 K/W | +10% |
| PCB Emissivity | 0.85 | +10% |
| PCB FR4 in-plane conductivity | 0.8 W/mK | 10% |
| PCB FR4 out-of-plane conductivity | 0.25 W/mK | +10% |
| PCB thermal vias | On | On - off |
| Box emissivity | 0.91 | +10% |
| CFD | On | On - off |
| Radiation | On | On - off |
| Still air chamber inclination | 0 º | ±5˚ |