| Materials | Dimensions | Conductivity (W/m K) | ||
| in-plane | out-of-plane | |||
| PCB | Prepeg | 226 μm thick | 0.8 | 0.25 |
| Core | 927 μm thick | |||
| Copper | 30 μm thick | 385 | ||
| BGA Equivalent | 400 μm diameter 1 mm pitch 500 μm thick | 1 × 10−3 | 6.64 | |
| C4 Equivalent | 100 μm diameter 200 μm pitch | 0.7 | 5.98 | |
| Substrate | Copper | 15 μm thick | 385 | |
| Core | 400 μm thick | 0.65 | ||
| Diel. | 33 μm thick | 0..49 | ||
| Underfill | 65 μm thick | 0.65 | ||
| Die (Silicon) | 785 μm thick | 148 | ||
| TIM | 15 μm thick | 2.6 | ||
| Sealband | 4 mm width | 3.2 | ||
| Lid | 1 mm thick | 385 | ||