|
| x (mm) | y (mm) | x (mm) | y (mm) | |
| Top of the package | Lid center | 0 | 0 | ||
| Chip corner (over the lid) | −6 | 6 | 6 | −6 | |
| Lid corner | −20 | 20 | 20 | −20 | |
| PCB | −32 | 30 | 30 | −32 | |
| PCB corner | −56 | 51 | 51 | −56 | |
| In-situ | Die Center | −1 | 0 | 1 | 1 |
| Die Corner | −4.5 | −4.5 | 4.5 | 4.5 | |
| Die Corner | −4.5 | 4.5 | 4.5 | −4.5 | |
| Bottom of the package | Li center(under the PCB) | 0 | 0 | ||
| Chip corner (under the PCB) | −6 | 6 | 6 | −6 | |
| Lid corner (under the PCB) | −20 | 20 | 20 | −20 | |
| PCB | −32 | 30 | 30 | −32 | |
| PCB corner | −56 | 51 | 51 | −56 |