| Parameters | Nominal value | Relative variation of thermal resistance | References |
| PCB copper layers | 2 vs. 4 layers | 54% | [8] [14] |
| PCB thermal vias | On-off | 14% | [8] [14] |
| Flow velocity | 2 m/s | 9.4% | [15] |
| Underfill/C4 (between the two chips) thermal resistivity | 50 mm2K/W | 9.1% | [13] |
| Operating power | 40 W | 7% | [16] |
| TIM thermal resistivity | 10 mm2K/W | 5.3% | [13] |
| Flow angle | 0˚ | 5% | [15] |
| CFD | On-off (empirical formulas) | 2% | [8] [14] |
| Enclosure width | 60 mm | 2% | [16] |
| Distance between the heat sink and the enclosure | 5.5 mm | 1.1% | [15] |
| PCB thermal BGA | On-off | 1% | [8] [14] |
| Substrate thermal resistivity | 60 mm2K/W | 0.7% | [13] |
| Heatsink conductivity | 151 W/mK | 0.34% | [15] |
| Underfill/C4 (between the lower chip to substrate) thermal resistivity | 75 mm2K/W | negligible | [13] |
| Sealband thermal resistivity | 600 mm2K/W | negligible | [13] |