Parameters | Nominal value | Relative variation of thermal resistance | References |
PCB copper layers | 2 vs. 4 layers | 54% | [8] [14] |
PCB thermal vias | On-off | 14% | [8] [14] |
Flow velocity | 2 m/s | 9.4% | [15] |
Underfill/C4 (between the two chips) thermal resistivity | 50 mm2K/W | 9.1% | [13] |
Operating power | 40 W | 7% | [16] |
TIM thermal resistivity | 10 mm2K/W | 5.3% | [13] |
Flow angle | 0˚ | 5% | [15] |
CFD | On-off (empirical formulas) | 2% | [8] [14] |
Enclosure width | 60 mm | 2% | [16] |
Distance between the heat sink and the enclosure | 5.5 mm | 1.1% | [15] |
PCB thermal BGA | On-off | 1% | [8] [14] |
Substrate thermal resistivity | 60 mm2K/W | 0.7% | [13] |
Heatsink conductivity | 151 W/mK | 0.34% | [15] |
Underfill/C4 (between the lower chip to substrate) thermal resistivity | 75 mm2K/W | negligible | [13] |
Sealband thermal resistivity | 600 mm2K/W | negligible | [13] |