№	Target sputtering mode							Coating deposition mode								Coating composition and properties
	Discharge current	Current density					Power density	Deposition speed					Substrate temperature			Element concentration, at. %						Layer thickness	Roughness^* R_a
	A	mA/cm²					W/cm²	µm/min					˚C			Сu	С					µm	nm
	Pure copper target
1	4	182					91	1.5					350			100	-					45	19/73
	Pure MПГ-7 graphite target
2	2	91					46	0.05					350			-	100					1.5	19/25
	Cu―82%, С―18% target
3	4		182				91			1.2		350			82				18		36				19/191
4	2		91				46			0.6		350			83				17		27				19/127
5	1		22				16			0.2		350			86				14		12				19/26
	Cu―65%, С―35% target
6	4		182		91				0.4		350			65				35		16				19/60
	Cu―28%, С―72% target
7	2			91		46			0.1		350			28				72		4.0				19/45
	Cu―14%, С―86% target
8	2			91		46			0.08		350			14				86		4.8				19/29
	Cu―7%, С―93% target
9	2			91		46			0.06		350			7				93		3.6				19/22