Sample | Studied diffusion area | Junction depth (µm) | |||||
Chemical etching method | Electrochemical plating method | SEI | SEPC | EBIC | Spreading resistance for reference | ||
n-p | n | 9.1 (1.1) | 9.2 (1.0) | 8.3 (2.1) | 8.0 (0.1) | 8.4 (1.3) | 8.0 |
n-p-n-p | n+ | 10.4 (1.0) | 10.9 (1.4) | 9.2 (2.3) | 9.8 (0.2) | 10.3 (1.5) | 10.0 |
p+ (front side) | 23.3 (1.5) | (*) | (*) | (*) | (*) | 25.0 | |
p | 72.6 (2.1) | 74.1 (1.6) | 74.7 (4.3) | 72.5 (0.2) | 74.8 (2.6) | 72.0 | |
p+ (back side) | 22.9 (1.4) | 23.2 (1.3) | 24.7 (3.0) | 22.4 (0.2) | 23.1 (1.7) | 22.0 |