Eff. | Area (cm2) | Voc (V) | Jsc (mA/cm2) | FF (%) | Inter-connect | Note |
25.5 | 0.25 | 2.847 | 10.94 | 81.83 | Wafer bonding | OCU 2015 |
28.2 25.6 /2.6 | 0.95 |
2.33 0.52 |
13.7 7.6 |
80.1 65.2 | 4-terminal | TTI 2016 |
33.0
| 3.604 | 2.446 0.694 | 13.9 8.3 | 84.7 76.6 | 4-terminal | Sharp 2017 |
30.8 | 0.09538 | 3.03 | 12.72 | 80.0 | PdNP array | AIST 2019 |