Plating Baths Composition

Agent

C (mol/L)

Solution S 50 wt% W

Solution I 40 wt% W

Solution X 30 wt% W

NiSO₄*7H₂O

Nickel Sulfate heptahydrate

0.06

0.06

0.08

Na₂WO₄*2H₂O

Sodium Tungstate dihydrate

0.15

0.15

0.02

Na₃C₆H₅ O₇*2H₂O

Trisodium citrate dihydrate

0.50

0.50

0.50

NH₄Cl

Ammonium chloride

0.10

0.60

0.60

Na₂CO₃

Sodium Carbonate

0.01

0.10

0.10

H₃BO₃

Boric acid

0.50

0.50

0.10

Plating Conditions

Current density i (mA/cm²)

Deposition time t (min)

T (˚C)

pH

70

60

65

8.8