Parameters

Antenna Cover

Heat shield

Thermal protection layer

Metal connecting ring

Bonding agent

Materials

SCFC

Silicon dioxide based porous materials

Silicone based materials

Invar

High temperature bonding agent

Density (kg/m³)

1950

0.3 × 10³ -

0.4 × 10³

0.9 × 10³ -

1.2 × 10³

8.1 × 10³

1.1 × 10³

Thermal conductivity

(W/mK)

0.78 (25˚C)

0.91 (300˚C)

1.25 (800˚C)

0.06 (25˚C)

0.1 (600˚C)

0.2 - 0.5

10 - 13

0.2 - 0.3

Specific heat

(J/kg∙K)

756 (25˚C)

1008 (300˚C)

1176 (800˚C)

630 - 700

1100 - 1200

515

1740